Huck Beng Chew

Associate Professor at UIUC Aerospace Engineering Department

Education:

• National University of Singapore Doctor of Philosophy, Mechanical Engineering, 2007.
• National University of Singapore Master of Engineering, Mechanical Engineering (Accelerated Masters Program), 2003
• National University of Singapore Bachelor of Engineering (1st Class Honors; University Scholar Program), Mechanical Engineering, 2002

Academic Positions:

University of Illinois Urbana Champaign, Il

• Affiliate Associate Professor, Computational Science and Engineering, Aug 2018 – Present
• Associate Professor, Aerospace Engineering, Aug 2018 – Present
• Affiliate Assistant Professor, Computational Science and Engineering, Sept 2011-July 2018
• Assistant Professor, Aerospace Engineering, Aug 2011 – July 2018

Brown University, Providence, RI

• Assistant Professor (Research), School of Engineering, June – Aug 2011

Professional Registrations:

• Registered Chartered Environmental Engineer (UK) CEnv (since 2010)
• Registered Chartered Engineer (UK) CEng (since 2007)
• Fellow of the Institute of Mechanical Engineers, FIMechE (since 2014; member since 2007)

Chapter in Books:

Chew, H.B., Guo, T.F. and Cheng, L., Mechanism-based modeling of thermal and moisture induced failure of IC devices, in: Moisture Sensitivity of Plastic Packages of IC Devices, Chapter 12. Editors: Fan, X.J. and Suhir, E. 1st Edition, Springer 2010, pp. 301-331, ISBN: 978-1-4419-5718-4.